Incoming Wafer Clean (Izm-26) - Pr896606-2590-P Tender

• Country: Germany
• Summary: Incoming Wafer Clean (Izm-26) - Pr896606-2590-P
• DET Ref No: 117540419
• Deadline: 12 May 2025
• Financier: Self Financed
• Purchaser Ownership: Government
• Tender Value: Refer Document
• Notice Type: Tender
• Document Ref. No.: 237844-2025
• Purchaser's Detail:
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• Description:
• 1 piece: Incoming Wafer Cleaner The "Incoming Wafer Cleaner" is essential for any type of microelectronic component or packaging technology, as the substrates must be cleaned of particles and impurities before they can be processed in the cleanroom. As the structure size of the features built into the components is in the micrometre range, even the smallest particles can cause fatal defects and thus significantly reduce the production yield. Substrates must also be cleaned after each process step and/or after external processing of the substrates. Wafer bonding in various technologies can be achieved without loss of yield using a state-of-the-art input cleaning system. External suppliers cannot be used for this process, as the substrates must be cleaned in good time within the process chain (or as incoming clean from outsourced processes). Corresponding facilities are not yet available at IZM. The chemicals required can be DI high-pressure water or other chemicals (such as solvents or acids/bases); mechanically assisted methods (e.g. scrubbing) can also be used to improve cleaning efficiency. The device should be suitable for both automatic carrier-to-carrier handling and semi-automatic handling of individual substrates (round/square shape). Optional features: - The machine must have a 200 mm wafer carrier. - The machine must have a 150 mm wafer carrier. - The machine must have a 100 mm wafer carrier. - The system must be able to perform a heated Piranha cleaning process (H2S...
• Documents:

 Tender Notice