Tender Details

Country: Germany
Summary: Layer Thickness Measuring Device for Wafer Space
DET Ref No: 82182058
Deadline: 10 May 2023
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.:
Purchaser's Detail:
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Description:
a) For the submission of the offer, prompting place: Name of the client: Technical University of Chemnitz; Area/department: 3.5 - procurement; Street, house number: Street of Nations 62; Postcode: 09111; Location: Chemnitz; Country Germany; Email: verwreischung@verwaltung.tu-chemnitz.de; Telephone number: +49 37153112350; Fax: +49 37153112359; Internet address: www.tu-chemnitz.de; The contract granted: see above; Place in which the offers or applications for participation must be submitted: see above) Type of award: Public tender c) Form in which applications or offers must be submitted: Offers can only be submitted in writing. d) Type and scope of the performance: layer -thick measuring device for the implementation of layer thickness measurements on structured semiconductor wafers up to 200 mm diameter. Delivery as a complete device including microscope, measuring heads, evaluation unit and evaluation software.; Places of the provision of services: Postcode: 09126; Location: Chemnitz; Country: Germany e) possibly number, size and type of the individual loose: If there is no relief f) side offers are not permitted g) execution period: start: not specified; End: 27.08.2023 h) The awarded ...
Documents:

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Layer Thickness Measuring Device for Wafer Space - Germany Tender

The TECHNICAL UNIVERSITY OF CHEMNITZ, a Government sector organization in Germany, has announced a new tender for Layer Thickness Measuring Device for Wafer Space. This tender is published on GermanyTenders under DET Ref No: 82182058 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2023-05-10.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.