Process Module for the Processing of Individual Wafers Tender
Notice for Process Module for the Processing of Individual Wafers in the Lift-Off Process. in Germany. The reference ID of the tender is 117323823 and it is closing on 12 May 2025.
Tender Details
- Country: Germany
- Summary: Process Module for the Processing of Individual Wafers in the Lift-Off Process.
- DET Ref No: 117323823
- Deadline: 12 May 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: Z.841ha-0252#0001
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- Description:
- Delivery, structure and commissioning of 1 piece process module for the processing of individual wafers in the lift-off process. Dimethylsulfoxide (DMSO) must be used as a process chemical. The DMSO must be heated up and brought to high pressure. In addition, high -purity water (DIW) must0.055 μs/cm to be used to rinse.Lift-off process.
- Documents:
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CLICK HERE TO LOGINProcess Module for the Processing of Individual Wafers in the Lift-Off Process. - Germany Tender
The PHYSICAL-TECHNICAL FEDERAL INSTITUTE, a Government sector organization in Germany, has announced a new tender for Process Module for the Processing of Individual Wafers in the Lift-Off Process.. This tender is published on GermanyTenders under DET Ref No: 117323823 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-05-12.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
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