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Project 691: "Extreme Backside Thinning of Integrated Circuits"

GermanyTenders notice for Project 691: "Extreme Backside Thinning of Integrated Circuits". The reference ID of the tender is 129135919 and it is closing on 01 Dec 2025.

Tender Details

  • Country: Germany
  • Summary: Project 691: "Extreme Backside Thinning of Integrated Circuits"
  • DET Ref No: 129135919
  • Deadline: 01 Dec 2025
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: Projekt 691
  • Purchaser's Detail:
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  • Description:
  • The tender content of Project 691 includes the development of a process for thinning the back of the die of chips in different designs with the following requirements: - Even if the die is curved for technical reasons, a defined area of ​​2mm by 2mm can be reliably thinned become. -The silicon residual thickness is 0.5um with a tolerance of 0.25um. The measurement of the remaining silicon thickness is part of the process and achieves an accuracy of 0.1um. -Chips remain functional with a reliability of at least 90% when the back is thinned. Furthermore, should extensive and detailed documentation of the process must be carried out and a process manual created, which enables experts in the field of chip preparation to independently apply the developed process or product. In addition, 40 appropriately prepared chips are required be delivered.
    IT services: consulting, software development, Internet and support (CPV code: 72000000)
    Project 691: "Extreme backside thinning integrated circuits
  • Documents:

 Tender Notice

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Project 691: "Extreme Backside Thinning of Integrated Circuits" - Germany Tender

The FEDERAL OFFICE FOR INFORMATION SECURITY, a Government sector organization in Germany, has announced a new tender for Project 691: "Extreme Backside Thinning of Integrated Circuits". This tender is published on GermanyTenders under DET Ref No: 129135919 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-12-01.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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