Wafer Saw Tender

• Country: Germany
• Summary: Wafer Saw
• DET Ref No: 136993201
• Deadline: 02 Apr 2026
• Financier: Self Financed
• Purchaser Ownership: Government
• Tender Value: Refer Document
• Notice Type: Tender
• Document Ref. No.: 25-178
• Purchaser's Detail:
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• Description:
• The Institute of Semiconductor Optics and Functional Interfaces (IHFG) has developed InAs quantum dot (QD) structures that emit in the C-band of the telecommunications sector and on metamorphic buffer layers (MMBs) made of InGaAs on a GaAs platform based. The growth of these QD structures is currently optimized for small substrates (15 × 15 mm2 samples), but efforts are underway to scale it to full 4-inch wafers. The IHFG wants to increase the intrinsic growth gradient across wafers to develop photonic cavities (particularly bullseye cavities) that operate at different wavelengths for different quantum applications. In such a case, the fabrication of the bullseye cavity would require only a single one require an epitaxy growth step, followed by wafer bonding to a silicon carrier wafer, membrane processing, and high-precision dicing to produce numerous chips covering a range of cavity wavelengths. In addition, for the fabrication of waveguides in which telecom QDs are embedded, the facets of the waveguides must be prepared using a ductile cutting process to achieve optically smooth surfaces suitable for a efficient light coupling are suitable. For the integration of the QD membrane into silicon-based photonic integrated platforms to realize III-V/Si-based quantum photonic integrated circuits (QPICs), the integrated circuit must be on Siliziumbasis geschnitten werden. A high-precision cutting saw is essential for all of the applications mentioned. Laboratory, optical and precision equipment (excl. glasses) (CPV code: 38000000)
• Documents:

 Tender Notice