- Country: Germany
- Summary: Waferbonder (Izm-31 - Pr915379-2590-P
- DET Ref No: 115675754
- Deadline: 03 Apr 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: 142407-2025
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- Description:
- This 1 piece equipment is used for highly accurate bonding of wafers with polymer/metal surfaces or different semiconductor material surfaces. Is essential for integration of heterogeneous materials and will include two different bonding chambers (with option to upgrade to four chambers) with capability to apply defined heat, pressure, vacuum and purge gas conditions. The system enables in-line wafer cleaning and plasma activation as well as high precicison wafer to wafer alignment and bonding in fully automatic and semi-automatic precipe controlled processe sequences. Optional features: - Substrate Handling: Software to read and log ID numbers from wafers; For top , bottom or double sided reading; SEMI T1 (barcode), SEMI M12, SEMI M13 (both alphanumeric), SEMI T7 (data matrix code) compliant) - Software: Machine should provide a SECS/GEM interface
Doc Title: Waferbonder (IZM-31 - PR915379-2590-P
Contract Type: supplies - Documents:
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CLICK HERE TO LOGINWaferbonder (Izm-31 - Pr915379-2590-P - Germany Tender
The FRAUNHOFER-GESELLSCHAFT - EINKAUF B12, a Government sector organization in Germany, has announced a new tender for Waferbonder (Izm-31 - Pr915379-2590-P. This tender is published on GermanyTenders under DET Ref No: 115675754 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-04-03.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
